back cover glass adhesive bonding
JCID V1SE/V1S Pro Bus Detection Board With JC Drawing is used to quickly detect and diagnose the signal failure point of the mobile phone motherboard
AIXUN T420D soldering target and environment
YCS Adjustable parameter spot welder with color screen for real-time welding data
Mijing CH5 Intelligent motherboard preheating layered desoldering platform with CH5 CH5-BC CH5-E mold for iPhone X-12 Pro Max motherboard disassembly
MECHANIC TA-212 Dual Soldering Station with T12 T210 Handle Voltage:220V EU Plug back cover glass adhesive bondingMECHANIC TA 212 140W Double Soldering Station Digital Display Constant Temperature Soldering Iron with T12 T210 Handle for Mobile Phone repair. With dual independent displays, dual temperature control stations, and five quick change speeds, the T12 and C210 soldering iron tips are suitable for most soldering tasks, such as mobile phone motherboard soldering, CPU BGA chip welding, tinning and detinning, and jumper wires. Features: 1. Dual independent